Semiconductor devices and methods of manufacturing the same

ABSTRACT

A semiconductor device includes a gate structure extending in a second direction on a substrate, a source/drain layer disposed on a portion of the substrate adjacent the gate structure in a first direction crossing the second direction, a first conductive contact plug on the gate structure, and a second contact plug structure disposed on the source/drain layer. The second contact plug structure includes a second conductive contact plug and an insulation pattern, and the second conductive contact plug and the insulation pattern are disposed in the second direction and contact each other. The first conductive contact plug and the insulation pattern are adjacent to each other in the first direction. The first and second conductive contact plugs are spaced apart from each other.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority under 35 USC §119 to Korean PatentApplication No. 10-2015-0061423, filed on Apr. 30, 2015 in the KoreanIntellectual Property Office (KIPO), the disclosure of which isincorporated by reference in its entirety herein.

BACKGROUND

1. Technical Field

Exemplary embodiments relate to semiconductor devices and methods ofmanufacturing the same. More particularly, exemplary embodiments relateto semiconductor devices including contact plugs and methods ofmanufacturing the same.

2. Discussion of Related Art

In a logic device, a contact plug may contact a top surface of a gateelectrode or a source/drain layer on an active region of a substrate. Ashort circuit may develop between a first contact plug contacting a topsurface of a gate electrode extending in a direction and a secondcontact plug contacting a source/drain layer. A short circuit is anelectrical circuit that allows a current to travel along an unintendedpath. However, the presence of this short circuit may deteriorate theintegration degree of the logic device.

SUMMARY

At least one embodiment of the inventive concept provides asemiconductor device having an enhanced integration degree.

At least one embodiment of the inventive concept provides a method ofmanufacturing a semiconductor device having an enhanced integrationdegree.

According to an exemplary embodiment of the inventive concept, there isprovided a semiconductor device. The semiconductor device includes agate structure extending in a second direction on a substrate, asource/drain layer disposed on a portion of the substrate adjacent thegate structure in a first direction crossing the second direction, afirst conductive contact plug disposed on the gate structure, and asecond contact plug structure disposed on the source/drain layer. Thesecond contact plug structure includes a second conductive contact plugand an insulation pattern, and the second conductive contact plug andthe insulation pattern are disposed in the second direction and contacteach other. The first conductive contact plug and the insulation patternare adjacent to each other in the first direction. The first and secondconductive contact plugs are spaced apart from each other.

In an exemplary embodiment, the semiconductor device further includes ametal silicide pattern disposed on the source/drain layer, where thesecond contact plug contacts an upper surface of the metal silicidepattern.

In an exemplary embodiment, the metal silicide pattern is formed on anentire upper surface of the source/drain layer, and the secondconductive contact plug contacts an upper surface of a portion of themetal silicide pattern.

In an exemplary embodiment, the first conductive contact plug and theinsulation pattern contact each other.

In an exemplary embodiment, the semiconductor device further includes agate spacer disposed on sidewalls of the gate structure in the firstdirection, where the second contact plug structure contacts an outersidewall of the gate spacer.

In an exemplary embodiment, the semiconductor device further includes ametal silicide pattern and a conductive pattern structure sequentiallystacked between the source/drain layer and the second contact plugstructure, where an upper surface of a portion of the metal silicidepattern and a top surface of the conductive pattern structure contactthe second contact plug structure.

In an exemplary embodiment, the metal silicide pattern is disposed on aninner wall of a recess, the recess being on the source/drain layer, andthe conductive pattern structure fills a remaining portion of the recesson the metal silicide pattern.

In an exemplary embodiment, the conductive pattern structure includes afirst conductive pattern and a first barrier pattern covering a bottomand a sidewall of the first conductive pattern.

In an exemplary embodiment, the first conductive pattern includestungsten, and the first barrier pattern includes titanium nitride.

In an exemplary embodiment, the semiconductor device further includes agate spacer disposed on sidewalls of the gate structure in the firstdirection, where the second contact structure does not contact an outersidewall of the gate spacer.

In an exemplary embodiment, the insulation pattern includes a low-kdielectric material.

In an exemplary embodiment, the first conductive contact plug includes asecond conductive pattern and a second barrier pattern covering a bottomand a sidewall of the second conductive pattern, where the secondconductive contact plug includes a third conductive pattern and a thirdbarrier pattern covering a bottom and a sidewall of the third conductivepattern.

In an exemplary embodiment, the second and third conductive patternsinclude tungsten, and the second and third barrier patterns includetitanium nitride.

In an exemplary embodiment, the semiconductor device further includes anisolation pattern disposed on the substrate, and an active finprotruding from the substrate, where a lower sidewall of the active finis covered by the isolation pattern.

In an exemplary embodiment, a plurality of active fins are formed to bespaced apart from each other in the second direction, where asource/drain layer commonly contacts first active fins among theplurality of active fins, and the first active fins are adjacent to eachother in the second direction.

In an exemplary embodiment, a plurality of source/drain layers arespaced apart from each other on the substrate in the second direction,where the second contact plug structure vertically overlaps each of thesource/drain layers, and the first conductive contact plug is disposedon the gate structure adjacent the second contact plug structure in thefirst direction, and the first conductive contact plug and the secondcontact plug structure are not disposed between neighboring ones of thesource/drain layer spaced apart from each other in the second direction.

In an exemplary embodiment, the semiconductor device further includes anisolation pattern disposed on the substrate, where the substrate isdivided into an active region and a field region by the isolationpattern, and a plurality of active regions are spaced apart from eachother in the second direction.

In an exemplary embodiment, the source/drain layer is disposed betweenneighboring ones of the active regions spaced apart from each other inthe second direction, where the first conductive contact plug and thesecond contact plug structure vertically overlap each of the activeregions, and are not disposed on the field region between neighboringones of the active regions spaced apart from each other in the seconddirection.

In an exemplary embodiment, the source/drain layer includes doped singlecrystalline silicon, doped single crystalline silicon carbide, or dopedsingle crystalline silicon-germanium.

In an exemplary embodiment, the gate structure includes a gate electrodeand a gate insulation pattern covering a bottom and a sidewall of thegate electrode.

In an exemplary embodiment, the gate electrode includes a metal, and thegate insulation pattern includes a high-k dielectric material.

In an exemplary embodiment, the semiconductor device further includes aninterface pattern including an oxide disposed between the substrate andthe gate insulation pattern.

In an exemplary embodiment, the first and second directions cross eachother at a right angle.

According to an exemplary embodiment of the inventive concept, there isprovided a semiconductor device. The semiconductor device includes aplurality of first active fin groups, a gate structure, a plurality ofsource/drain layers, a metal silicide pattern, a second conductivecontact plug, and a first conductive contact plug. The plurality offirst active fin groups are spaced apart from each other in a seconddirection at a second distance, and each of the first active fin groupsincludes a plurality of first active fins spaced apart from each otherin the second direction at a first distance smaller than the seconddistance. Each of the first active fins protrude from the substrate andextend in a first direction substantially perpendicular to the seconddirection. The gate structure extends in the second direction and isdisposed on a portion of the substrate having the first active fingroups. The plurality of source/drain layers are spaced apart from eachother in the second direction, and each of the source/drain layers aredisposed on a portion of each of the first active fin groups adjacentthe gate structure. The metal silicide pattern is disposed on each ofthe source/drain layers. The second conductive contact plug contacts anupper surface of a first portion of the metal silicide pattern. Thefirst conductive contact plug contacts an upper surface of a portion ofthe gate structure adjacent each of the source/drain layers in the firstdirection, and is spaced apart from the second conductive contact plug.

In an exemplary embodiment, the semiconductor device further includes aninsulation pattern contacting an upper surface of a second other portionof the metal silicide pattern, where the insulation pattern and thesecond conductive contact plug are disposed in the second direction andcontacting each other.

In an exemplary embodiment, the semiconductor device further includes aconductive pattern structure disposed between the metal silicide patternand the second contact plug structure, where the second contact plugstructure includes the second conductive contact plug and the insulationpattern.

In an exemplary embodiment, the conductive pattern structure includes afirst conductive pattern and a first barrier pattern covering a bottomand a sidewall of the first conductive pattern.

In an exemplary embodiment, the insulation pattern includes a low-kdielectric material.

In an exemplary embodiment, the semiconductor device further includes agate spacer disposed on sidewalls of the gate structure in the firstdirection, where the second contact plug structure contacts an outersidewall of the gate spacer.

In an exemplary embodiment, the semiconductor device further includes agate spacer disposed on sidewalls of the gate structure in the firstdirection, where the second contact plug structure does not contact anouter sidewall of the gate spacer.

In an exemplary embodiment, top surfaces of the first and secondconductive contact plugs and a top surface of the insulation pattern aresubstantially coplanar with each other.

In an exemplary embodiment, the first and second conductive contactplugs include substantially the same material.

In an exemplary embodiment, the semiconductor device further includes anisolation pattern covering a lower sidewall of each of the active finson the substrate, where the gate structure is disposed on the firstactive fins and the isolation pattern.

In an exemplary embodiment, a plurality of gate structures are disposedon the substrate and spaced apart from each other in the firstdirection, and each of the source/drain layers are disposed on a portionof each of the first active fin groups between the gate structures.

In an exemplary embodiment, each of the source/drain layers includedoped single crystalline silicon, doped single crystalline siliconcarbide, or doped single crystalline silicon-germanium.

According to an exemplary embodiment of the inventive concept, there isprovided a semiconductor device. The semiconductor device includes anactive region, a gate structure, a source/drain layer, a metal silicidepattern, a second conductive contact plug, and a first conductivecontact plug. The active region is defined by an isolation patterndisposed on a substrate, and extends in a first direction. The gatestructure is disposed on the active region and the isolation pattern andextends in a second direction substantially perpendicular to the firstdirection. The source/drain layer is disposed on a portion of the activeregion adjacent sidewalls of the gate structure in the first direction.The metal silicide pattern is disposed on the source/drain layer. Thesecond conductive contact plug contacts an upper surface of a firstportion of the metal silicide pattern. The first conductive contact plugcontacts a top surface of a portion of the gate structure verticallyoverlapping the active region, and spaced apart from the secondconductive contact plug.

In an exemplary embodiment, the semiconductor device further includes aninsulation pattern contacting an upper surface of a second other portionof the metal silicide pattern, where the insulation pattern and thesecond conductive contact plug are disposed in the second direction andcontact each other. The second conductive contact plug and theinsulation pattern may form a second contact plug structure.

In an exemplary embodiment, the semiconductor device further includes aconductive pattern structure disposed between the metal silicide patternand the second contact plug structure.

In an exemplary embodiment, top surfaces of the first and secondconductive contact plugs and a top surface of the insulation pattern aresubstantially coplanar with each other.

In an exemplary embodiment, a plurality of active regions are spacedapart from each other on the substrate in the second direction, wherethe first and second conductive contact plugs are not disposed betweenthe active regions spaced apart from each other in the second direction.

According to an exemplary embodiment of the inventive concept, there isprovided a method of manufacturing a semiconductor device. The methodincludes: forming a dummy gate structure extending in a second directionon a substrate; forming a source/drain layer on a portion of thesubstrate adjacent the dummy gate structure in a first directioncrossing the second direction; replacing the dummy gate structure with agate structure; forming a first conductive contact plug on a top surfaceof a portion of the gate structure; and forming a second contact plugstructure on the source/drain layer. The second contact plug structureincludes a second conductive contact plug and an insulation patterndisposed in the second direction and contacting each other. The firstconductive contact plug and the insulation pattern are adjacent to eachother in the first direction, and the first and second conductivecontact plugs are spaced apart from each other.

In an exemplary embodiment, after the dummy gate structure is replacedwith the gate structure, a metal silicide pattern is formed on thesource/drain layer, where the second contact plug structure contacts anupper surface of the metal silicide pattern.

In an exemplary embodiment, the forming of the metal silicide patternincludes: forming an insulating interlayer on the substrate to cover thegate structure and the source/drain layer; forming a first opening toexpose an upper surface of the source/drain layer; forming a metal layeron the exposed upper surface of the source/drain layer, a sidewall ofthe first opening, and the insulating interlayer; and performing a heattreatment process so that the metal layer and the exposed upper surfaceof the source/drain layer react with each other to form the metalsilicide pattern.

In an exemplary embodiment, after the metal layer is formed, the methodincludes: forming a first barrier layer on the metal layer; and forminga first conductive layer on the first barrier layer to fill a remainingportion of the first opening, where the heat treatment process isperformed after the first conductive layer is formed.

In an exemplary embodiment, after the heat treatment process isperformed, the method includes removing the first conductive layer andthe first barrier layer.

In exemplary embodiment, the first conductive layer and the firstbarrier layer are partially removed, so that a first barrier pattern anda first conductive pattern sequentially stacked remain on the metalsilicide pattern.

In exemplary embodiment, after the metal silicide pattern is formed, themethod includes: forming an insulation layer on the metal silicidepattern and the insulating interlayer to fill the first opening;partially removing the insulation layer to form a second openingpartially exposing an upper surface of the metal silicide pattern;forming a sacrificial layer on the exposed upper surface of the metalsilicide pattern, the insulating interlayer and the insulation layer tofill the second opening; and partially removing the sacrificial layer,the insulation layer and the insulating interlayer to form a thirdopening partially exposing the top surface of the portion of the gatestructure.

In an exemplary embodiment, the forming of the first conductive contactplug on the top surface of the portion of the gate structure and theforming of the second contact plug structure on the source/drain layerincludes: removing the sacrificial layer to form the second openingagain exposing an upper surface of a portion of the metal silicidepattern; forming a second barrier layer on the exposed upper surface ofthe portion of the metal silicide pattern, the exposed top surface ofthe portion of the gate structure, and inner walls of the second andthird openings; and forming a second conductive layer on the secondbarrier layer to fill remaining portions of the second and thirdopenings.

In an exemplary embodiment, the second conductive layer, the secondbarrier layer and the insulation layer are planarized, such that thefirst conductive contact plug is formed on the top surface of theportion of the gate structure and the second contact plug structure isformed on the upper surface of the portion of the metal silicidepattern. In this embodiment, the first conductive contact plug includesa second barrier pattern and a second conductive pattern sequentiallystacked. In this embodiment, the second contact plug structure includesthe insulation pattern and the second conductive contact plug. In thisembodiment, the second conductive contact plug has a third barrierpattern and a third conductive pattern sequentially stacked, where theinsulation pattern and the second conductive contact plug are disposedin the second direction.

In an exemplary embodiment, after the dummy gate structure is formed,the method includes forming a gate spacer on sidewalls of the gatestructure in the first direction, where the second contact plugstructure is formed to contact an outer sidewall of the gate spacer.

In an exemplary embodiment, before the dummy gate structure is formed onthe substrate, the method includes forming a trench on the substrate toform an active fin protruding from the substrate; and forming anisolation pattern on the substrate to partially fill the trench, andcover a lower sidewall of the active fin. In this embodiment, the dummygate structure is formed on the active fin and the isolation pattern.

In an exemplary embodiment, when forming of the active fin includesforming a plurality of active fins spaced apart from each other in thesecond direction. In an exemplary embodiment, the forming of thesource/drain layer includes: forming the source/drain layer to commonlycontact first active fins among the plurality of active fins, where thefirst active fins are adjacent to each other in the second direction.

In an exemplary embodiment, the forming of the source/drain layerincludes forming a plurality of source/drain layers spaced apart fromeach other in the second direction, where the second contact plugstructure is formed to vertically overlap each of the source/drainlayers, the first conductive contact plug is formed on the gatestructure adjacent the second contact plug structure in the firstdirection, and the first conductive contact plug and the second contactplug structure are not formed between the source/drain layers spacedapart from each other in the second direction.

In an exemplary embodiment, before the dummy gate structure is formed onthe substrate, the method includes forming an isolation pattern on thesubstrate, such that the substrate is divided into an active region anda field region, and a plurality of active regions are formed to bespaced apart from each other in the second direction. In an exemplaryembodiment, the forming of the source/drain layer includes forming aplurality of source/drain layers on the active regions, respectively,spaced apart from each other in the second direction. The firstconductive contact plug and the second contact plug structure do notvertically overlap each of the active regions, and are not formedbetween the active regions spaced apart from each other in the seconddirection.

In an exemplary embodiment, the first and second directions cross eachother at a right angle.

According to an exemplary embodiment of the inventive concept, there isprovided a method of manufacturing a semiconductor device. The methodincludes forming a trench and an isolation pattern on a substrate toform a plurality of first active fin groups spaced apart from each otherat a second distance. Each of the first active fin groups includes aplurality of first active fins spaced apart from each other in thesecond direction at a first distance smaller than the second distance.Each of the first active fins protrudes from the substrate and extendsin a first direction substantially perpendicular to the seconddirection. A lower sidewall of each of the first active fins is coveredby the isolation pattern. The method includes: forming a dummy gatestructure extending in the second direction on the first active fingroups and the isolation pattern; forming a source/drain layer on aportion of each of the first active fin groups adjacent the gatestructure; replacing a dummy gate structure with a gate structure;forming a metal silicide pattern on the source/drain layer; forming asecond conductive contact plug and a first conductive contact plug. Thesecond conductive contact plug contacts an upper surface of a portion ofthe metal silicide pattern, the first conductive contact plug contactsan upper surface of a first portion of the gate structure adjacent thesource/drain layer in the first direction. The first conductive contactplug is spaced apart from the second conductive contact plug.

In an exemplary embodiment, after the metal silicide pattern is formed,an insulation pattern contacting an upper surface of a second otherportion of the metal silicide pattern is formed, where a sidewall of theinsulation pattern contacts a sidewall of the second conductive contactplug. The second conductive contact plug and the insulation pattern mayform a second contact plug structure.

In an exemplary embodiment, before the insulation pattern is formed, aconductive pattern structure is formed on the metal silicide pattern.

According to an exemplary embodiment of the inventive concept, asemiconductor device is provided including a gate electrode, a sourceelectrode, a drain electrode, first through third conductive contactplugs, and first and second insulation patterns. The gate electrode isdisposed on a substrate and extends in a second direction. The sourceelectrode is disposed on the substrate adjacent a first side of the gateelectrode in a first direction crossing the second direction. The drainelectrode is disposed on the substrate adjacent a second side of thegate electrode in the first direction. The first conductive contact plugis disposed on the gate electrode. The second conductive contact plug isdisposed on the source electrode in the second direction. The thirdconductive contact plug is disposed on the drain electrode in the seconddirection. The first insulation pattern is disposed on the sourceelectrode in the second direction and contacts the second conductivecontact plug, and the second insulation pattern is disposed on the drainelectrode in the second direction and contacts the third conductivecontact plug.

In an embodiment, the second conductive contact plug is spaced apartfrom the first and the third conductive contact plugs.

In an embodiment, the semiconductor device includes a metal silicidepattern disposed on the source electrode and on the drain electrode.

A semiconductor device in accordance at least one embodiment may includethe metal silicide pattern, which is formed on the entire upper surfaceof the source/drain layer that is commonly formed on the first activefins included in each of the first active fin groups, and thus thecontact resistance between the metal silicide pattern and the first andsecond conductive contact plugs may be lowered. In an embodiment, thefirst and second conductive contact plugs are formed to overlap a regionin which one of the first active fin groups is formed, and are notformed on a region between neighboring ones of the first active fingroups spaced apart from each other in the second direction.Accordingly, the semiconductor device may have an enhanced integrationdegree.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments of the inventive concept will be more clearlyunderstood from the following detailed description taken in conjunctionwith the accompanying drawings.

FIGS. 1A, 1B, and 2 to 5 are plan views and cross-sectional viewsillustrating a semiconductor device in accordance with exampleembodiments of the inventive concept.

FIGS. 6 to 50 are plan views and cross-sectional views illustratingstages of a method of manufacturing a semiconductor device in accordancewith exemplary embodiments of the inventive concept.

FIGS. 51 to 55 are plan views and cross-sectional views illustrating asemiconductor device in accordance with exemplary embodiments of theinventive concept.

FIGS. 56 to 62 are plan views and cross-sectional views illustratingstages of a method of manufacturing a semiconductor device in accordancewith exemplary embodiments of the inventive concept.

FIGS. 63 to 67 are plan views and cross-sectional views illustrating asemiconductor device in accordance with exemplary embodiments of theinventive concept.

FIGS. 68 to 77 are plan views and cross-sectional views illustratingstages of a method of manufacturing a semiconductor device in accordancewith exemplary embodiments of the inventive concept.

FIGS. 78 to 82 are plan views and cross-sectional views illustrating asemiconductor device in accordance with exemplary embodiments of theinventive concept.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

The inventive concept will be described more fully hereinafter withreference to the accompanying drawings, in which exemplary embodimentsthereof are shown. The present inventive concept may, however, beembodied in many different forms and should not be construed as limitedto the exemplary embodiments set forth herein. Rather, these exemplaryembodiments are provided so that this description will be thorough andcomplete, and will fully convey the scope of the present inventiveconcept to those skilled in the art. In the drawings, the sizes andrelative sizes of layers and regions may be exaggerated for clarity.

It will be understood that when an element or layer is referred to asbeing “on,” “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layeror intervening elements or layers may be present. Like numerals refer tolike elements throughout. As used herein, the singular forms “a,” “an”and “the” are intended to include the plural forms as well, unless thecontext clearly indicates otherwise.

Exemplary embodiments are described herein with reference tocross-sectional illustrations that are schematic illustrations ofidealized example embodiments (and intermediate structures). As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, the exemplary embodiments should not be construed aslimited to the particular shapes of regions illustrated herein but areto include deviations in shapes that result, for example, frommanufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the figures are schematicin nature and their shapes are not intended to limit the scope of thepresent inventive concept.

FIGS. 1A, 1B, and 2 to 5 are plan views and cross-sectional viewsillustrating a semiconductor device in accordance with exemplaryembodiments of the inventive concept. Particularly, FIGS. 1A and 1B areplan views illustrating the semiconductor device, and FIGS. 2 to 5 arecross-sectional views illustrating the semiconductor device.

FIG. 2 is a cross-sectional view taken along a line A-A′ of FIG. 1B,FIG. 3 is a cross-sectional view taken along a line B-B′ of FIG. 1B,FIG. 4 is a cross-sectional view taken along a line C-C′ of FIG. 1B, andFIG. 5 is a cross-sectional view taken along a line D-D′ of FIG. 1B.FIG. 1B is an enlarged plan view of a region X of FIG. 1A, and FIG. 1Aonly shows an active fin, a gate structure, a gate spacer, and asource/drain layer in order to avoid the complexity. Hereinafter, thesemiconductor device and a method of manufacturing the semiconductordevice will be illustrated with reference to the figures of the regionX.

Referring to FIGS. 1A, 1B, and 2 to 5, the semiconductor device includesa gate structure 270, a source/drain layer 210, a first conductivecontact plug 432 and a second contact plug structure on a substrate 100.The semiconductor device further includes an active fin 105, a gatespacer 180, a fin spacer 190, a gate mask 280, a metal silicide pattern340, and first and second insulating interlayers 220 and 290.

The substrate 100 may include a semiconductor material (e.g., silicon,germanium, silicon-germanium, etc.) or III-V semiconductor compounds(e.g., GaP, GaAs, GaSb, etc.). In an embodiment, the substrate 100 is asilicon-on-insulator (SOI) substrate, or a germanium-on-insulator (GOI)substrate.

In an embodiment, an isolation pattern 130 is formed on the substrate100, and thus a field region of which a top surface is covered by theisolation pattern 130, and an active region of which a top surface isnot covered by the isolation pattern 130 and that protrudes from a topsurface of the isolation pattern 130 is defined in the substrate 100.The active region may be a region in which the active fin 105 having afin-like shape protruding upwardly is formed, and the field region maybe a region in which no active fin is formed. The active fin 105 may beformed by etching an upper portion of the substrate 100 to form trenches101 and 103 (refer to FIGS. 8 and 9) thereon, and thus may protrudeupwardly from other portions of the substrate 100 on which the trenches101 and 103 are formed. Accordingly, the active fin 105 may include amaterial substantially the same as that of the substrate 100.

In an exemplary embodiment, the active fin 105 extends in a firstdirection substantially parallel to a top surface of the substrate 100,and a plurality of active fins 105 are formed in a second directionsubstantially parallel to the top surface of the substrate 100 andcrossing the first direction. In an exemplary embodiment, the first andsecond directions cross each other at a right angle, and are thussubstantially perpendicular to each other. Hereinafter, the first andsecond directions in all drawings may be defined as those in FIGS. 1A,1B, and 2 to 5.

In an exemplary embodiment, first active fins 105 among the active fins105, which are adjacent to each other in the second direction, form afirst active fin group, and a plurality of first active fin groups areformed in the second direction. FIG. 1A shows that each of the firstactive fin groups includes three active fins 105, however, the inventiveconcept is not limited thereto, as each of the first active fin groupsmay include any number of the first active fins 105. In an exemplaryembodiment, the first active fins 105 included in each of the firstactive fin groups are spaced apart from each other at a first distanceD1 in the second direction, and the first active fin groups are spacedapart from each other at a second distance D2 greater than the firstdistance D1 in the second direction.

In an exemplary embodiment, the active fin 105 includes lower and upperactive patterns 105 b and 105 a sequentially stacked and integrallyformed with each other. As shown in FIG. 2, a sidewall of the loweractive pattern 105 b is covered by the isolation pattern 130, and theupper active pattern 105 a is not covered by the isolation pattern 130,but protrudes from the top surface of the isolation pattern 130. Theisolation pattern 130 may include an oxide (e.g., silicon oxide).

The gate structure 270 may extend in the second direction on the activefin 105 and the isolation pattern 130. In an exemplary embodiment, aplurality of gate structures 270 are formed in the first direction. Inan exemplary embodiment, the gate structure 270 includes a gateinsulation pattern 250 and a gate electrode 260 sequentially stacked.The gate structure 270 may further include an interface pattern 240located between the active fin 105 and the gate insulation pattern 250.

In an exemplary embodiment, the gate insulation pattern 250 is formed ona top surface and a sidewall of the upper active pattern 105 a of theactive fin 105, a top surface of the isolation pattern 130, an innerwall of the gate spacer 180, and covers a bottom and a sidewall of thegate electrode 260. In an embodiment where the interface pattern 240 isformed, the interface pattern 240 is formed only on the top surface andthe sidewall of the upper active pattern 105 a of the active fin 105. Inan exemplary embodiment, the interface pattern 240 is omitted. In anexemplary embodiment, the interface pattern 240 is formed on the topsurface and the sidewall of the upper active pattern 105 a of the activefin 105, the top surface of the isolation pattern 130, and the innerwall of the gate spacer 180, and the gate insulation pattern 250 isformed only on the interface pattern 240.

The interface pattern 240 may include an oxide (e.g., silicon oxide),the gate insulation pattern 250 may include a metal oxide having a highdielectric constant (e.g., hafnium oxide, tantalum oxide, zirconiumoxide, etc.), and the gate electrode 260 may include a metal having alow electrical resistance (e.g., aluminum, copper, tantalum, etc.), or ametal nitride. Alternatively, the gate electrode 260 may include dopedpolysilicon.

The gate spacer 180 may be formed on sidewalls of the gate structure 270opposite to each other in the first direction, and the fin spacer 190may be formed on sidewalls of the upper active pattern 105 a of theactive fin 105 opposite to each other in the second direction. The gatespacer 180 and the fin spacer 190 may include a nitride (e.g., siliconnitride, silicon oxynitride, silicon oxycarbonitride, etc.) and mayinclude substantially the same material. Thus, the gate spacer 180 andthe fin spacer 190 are not differentiated from each other at an area atwhich the gate spacer 180 and the fin spacer 190 contact each other, andmay be merged with each other.

In an exemplary embodiment, the gate mask 280 extends in the seconddirection, and covers a top surface of the gate structure 270. In anexemplary embodiment, a plurality of gate masks 280 are formed in thefirst direction. While the gate mask 280 is illustrated in FIG. 5covering a top surface of the gate spacer 180, the inventive concept isnot limited thereto. For example, in an exemplary embodiment, the topsurface of the gate spacer 180 is not covered by the gate mask 280 andis instead exposed.

The source/drain layer 210 may be formed on a portion of the active fin105 adjacent the gate structure 270 in the first direction. In anexemplary embodiment, the source/drain layer 210 fills a first recess200 (refer to FIGS. 18 to 20), which is formed on an upper portion ofthe active fin 105 between the gate structures 270 spaced apart fromeach other in the first direction, and a sidewall of which defined by aninner sidewall of the fin spacer 190. The first recess 200 may be formedby partially removing the upper active pattern 105 a and/or the loweractive pattern 105 b, and the source/drain layer 210 may not only fillthe first recess 200 but also grow (e.g., extend) upwardly to contact aportion of the gate spacer 180. The source/drain layer 210 may grow(e.g., extend) both in the vertical and horizontal directions over thefin spacer 190, and may have a cross-section taken along the seconddirection of which a shape may be a pentagon or a hexagon.

In an exemplary embodiment, pairs of the source/drain layers 210 on thefirst active fins 105, respectively, spaced apart from each other in thesecond direction at a first distance D1 may grow (e.g., extend) to bemerged with each other. Thus, only one merged source/drain layer 210 maybe formed on the first active fins 105 included in each of the firstactive fin groups. A plurality of source/drain layers 210 may be formedon the plurality of first active fin groups, respectively, spaced apartfrom each other in the second direction, which may be spaced apart fromeach other in the second direction.

The source/drain layer 210 may include single crystalline silicon orsingle crystalline silicon carbide doped with n-type impurities, andthus may serve as a source/drain region of a negative-channel metaloxide semiconductor (NMOS) transistor. Alternatively, the source/drainlayer 210 may include single crystalline silicon-germanium doped withp-type impurities, and thus may serve as a source/drain region of apositive-channel metal oxide semiconductor (PMOS) transistor.

In an exemplary embodiment, the first source/drain layer 210 illustratedin FIG. 5 is source region (e.g., source electrode) of a metal oxidesemiconductor transistor, the second source/drain layer 210 illustratedin FIG. 5 is a drain region (e.g., drain electrode) of the metal oxidesemiconductor, and the gate structure 270 is a gate electrode of themetal oxide semiconductor. In an exemplary embodiment, a semiconductordevice includes the substrate 100, a gate electrode 260 disposed on thesubstrate and extending in a second direction, the source electrodedisposed on the substrate 100 adjacent a first side of the gateelectrode in a first direction crossing the second direction, the drainelectrode disposed on the substrate 100 adjacent a second side of thegate electrode 260 in the first direction, a first conductive contactplug 432 disposed on the gate electrode 260, a second conductive contactplug 434 disposed on the source electrode in the second direction, and athird conductive contact plug (e.g., another 434), where the first andsecond conductive contact plugs are spaced apart from one another.

In an embodiment, the metal silicide pattern 340 is formed on thesource/drain layer 210. In an exemplary embodiment, the metal silicidepattern 340 is formed on the entire upper surface of the source/drainlayer 210 except for both end portions of the upper surface of thesource/drain layer 210 in the second direction. The metal silicidepattern 340 may include a metal silicide (e.g., titanium silicide,cobalt silicide, nickel silicide, etc.).

In an embodiment, the first insulating interlayer 220 is formed on theactive fin 105 and the isolation pattern 130, and covers an outersidewall of the gate spacer 180 on the sidewall of the gate structure270, the source/drain layer 210, the metal silicide pattern 340, and thefin spacer 190. In an embodiment, the second insulating interlayer 290is formed on the first insulating interlayer 220, and covers the gatemask 280. The first and second insulating interlayers 220 and 290 mayinclude an oxide (e.g., silicon oxide). The first and second insulatinginterlayers 220 and 290 may include a material substantially the same asor different from each other.

In an embodiment, the first conductive contact plug 432 penetratethrough the second insulating interlayer 290 and the gate mask 280, andcontact a top surface of the gate structure 270. While the firstconductive contact plug 432 also is illustrated in FIG. 5 as contactinga top surface of the gate spacer 180, the inventive concept is notlimited thereto.

In an exemplary embodiment, the second contact plug structure includes asecond conductive contact plug 434 and an insulation pattern 355, whichmay be disposed in the second direction and contact each other. In anembodiment, the second contact plug structure penetrates through thefirst and second insulating interlayers 220 and 290, and contacts anupper surface of the metal silicide pattern 340. In an exemplaryembodiment, the second contact plug structure contacts the outersidewall of the gate spacer 180.

In an exemplary embodiment, the first conductive contact plug 432 andthe insulation pattern 355 are adjacent to each other in the firstdirection, and further contact each other. However, the first and secondconductive contact plugs 432 and 434 do not contact each other, and arespaced apart from each other.

In an embodiment, the second conductive contact plug 434 contacts anupper surface of a first portion of the metal silicide pattern 340 on afirst source/drain layer among the source/drain layers 210, and thefirst conductive contact plug 432 contacts a top surface of the gatestructure 270 adjacent a second portion of the metal silicide pattern340 on the first source/drain layer among the source/drain layers 210.In an embodiment, the first and second portions of the metal silicidepattern 340 are spaced apart from each other in the second direction,and thus the first and second conductive contact plugs 432 and 434 donot contact each other, but are spaced apart from each other in thesecond direction.

In an exemplary embodiment, the first portion of the metal silicidepattern 340 is formed on a portion of the source/drain layer 210 on oneof the first active fins 105 in each of the first active fin groups, andthe second portion of the metal silicide pattern 340 is formed on aportion of the source/drain layer 210 on another of the first activefins 105 in each of the first active fin groups. The first and secondportions of the metal silicide pattern 340 may be spaced apart from eachother in the second direction.

In an embodiment, the first conductive contact plug 432 includes asecond conductive pattern 422, and a second barrier pattern 412 coveringa bottom and a sidewall of the second conductive pattern 422. In anembodiment, the second conductive contact plug 434 includes a thirdconductive pattern 424, and a third barrier pattern 414 covering abottom and a sidewall of the third conductive pattern 424.

In an embodiment, the insulation pattern 355 includes a low-k dielectricmaterial. A low-k dielectric material may refer to a material with asmall dielectric constant relative to silicon dioxide. The insulationpattern 355 may include a material that has good gap-fillingcharacteristics and can be easily planarized. Thus, in an exemplaryembodiment, the insulation pattern 355 includes single layer aluminametalized (SLAM).

In an exemplary embodiment, the second conductive contact plug 434 andthe insulation pattern 355 have substantially the same width in thefirst direction, and the first and second conductive contact plugs 432and 434 have top surfaces substantially coplanar with each other. Thetop surfaces of the first and second conductive contact plugs 432 and434 and the insulation pattern 355 may be substantially coplanar with atop surface of the second insulating interlayer 290.

In an exemplary embodiment, a semiconductor device includes the metalsilicide pattern 340, which is formed on the entire upper surface of thesource/drain layer 210 except for both end portions of the upper surfaceof the source/drain layer 210 in the second direction that is commonlyformed on the first active fins 105 included in each of the first activefin groups, and thus the contact resistance between the metal silicidepattern 340 and the first and second conductive contact plugs 432 and434 is lowered. In an embodiment, the first and second conductivecontact plugs 432 and 434 are formed to overlap a region in which one ofthe first active fin groups is formed, and is not formed on a regionbetween neighboring ones of the first active fin groups spaced apartfrom each other in the second direction. Accordingly, the semiconductordevice may have an enhanced integration degree.

FIGS. 6 to 50 are plan views and cross-sectional views illustratingstages of a method of manufacturing a semiconductor device in accordancewith an exemplary embodiment of the inventive concept. Particularly,FIGS. 6, 8, 10, 12, 15, 18, 21, 24, 27, 29, 32, 35, 44 and 47 are planviews, and FIGS. 7, 9, 11, 13-14, 16-17, 19-20, 22-23, 25-26, 28, 30-31,33-34, 36-43, 45-46 and 48-50 are cross-sectional views.

FIGS. 7, 9, 11, 13, 31 and 33 are cross-sectional views taken alonglines A-A′ of corresponding plan views, respectively, FIGS. 14, 16, 19,22, 25, 28, 30, 34, 36, 38, 40, 42, 45 and 48 are cross-sectional viewstaken along lines B-B′ of corresponding plan views, respectively, FIGS.17, 20, 23, 26, 37, 39, 41, 43, 46 and 49 are cross-sectional viewstaken along lines C-C′ of corresponding plan views, respectively, andFIG. 50 is a cross-sectional view taken along a line D-D′ of acorresponding plan view.

Referring to FIGS. 6 and 7, a plurality of masks 110 is formed on a topsurface of a substrate 100. In an embodiment, each of the masks 110extend in a first direction substantially parallel to a top surface of asubstrate 100, are formed in a second direction substantially parallelto the top surface of the substrate 100, and cross the first direction.A first photoresist pattern 120 is formed on the substrate 100 to coversome of the masks 110. In an exemplary embodiment, the first and seconddirections are substantially perpendicular to each other. Thephotoresist pattern 120 may be a light-sensitive material, which becomessoluble when exposed to light as an example.

The substrate 100 may include a semiconductor material (e.g., silicon,germanium, silicon-germanium, etc.) or III-V semiconductor compounds(e.g., GaP, GaAs, GaSb, etc.). In an exemplary embodiment, the substrate100 is a silicon-on-insulator (SOI) substrate or agermanium-on-insulator (GOI) substrate.

In an exemplary embodiment, the masks 110 are formed to be spaced apartfrom each other in the second direction at a constant distance. Forexample, the distance between each pair of masks 110 may be the same.The first photoresist pattern 120 may extend in the first direction, andcover a plurality of first masks 110 among the masks 110 that areadjacent to each other in the second direction. FIGS. 6 and 7 show thatthe first photoresist pattern 120 covers three first masks 110, however,the inventive concept is not limited thereto, as the first photoresistpattern 120 may cover any number of the first masks 110 adjacent to eachother in the second direction.

The plurality of first masks 110 adjacent to each other that are coveredby the first photoresist pattern 120 form a first mask group, and aplurality of first mask groups may be formed in the second direction.

Each of the masks 110 may include a nitride (e.g., silicon nitride).

Referring to FIGS. 8 and 9, after removing the masks 110 not covered bythe first photoresist pattern 120, the first photoresist pattern 120 isremoved. In an exemplary embodiment, the first photoresist pattern 120is removed by an ashing process (e.g., plasma ashing) and/or a strippingprocess.

Upper portions of the substrate 100 may be etched using the first masks110 as an etching mask to form first and second trenches 101 and 103.

The first trench 101 may be formed between neighboring ones of the firstmasks 110 spaced apart from each other in the second direction, which isincluded in each of the first mask groups, and the second trench 103 maybe formed between neighboring ones of the plurality of first mask groupsspaced apart from each other in the second direction. Thus, an activefin 105 may be formed under each of the first masks 110, which mayprotrude upwardly from the trenches 101 and 103.

In an exemplary embodiment, the active fin 105 extends in the firstdirection, and a plurality of active fins 105 are formed in the seconddirection. The active fins 105 formed by one of the first mask groupsform a first active fin group, and a plurality of first active fingroups may be formed in the second direction. In an exemplaryembodiment, the active fins 105 included in one of the first active fingroups (e.g., the first active fins 105) are spaced apart from eachother in the second direction at a first distance D1, and the pluralityof first active fin groups are spaced apart from each other in thesecond direction at a second distance D2 greater than the first distanceD1 (refer to FIG. 1A).

Referring to FIGS. 10 and 11, an isolation pattern 130 is formed on thesubstrate 100 to fill a lower portion of each of the first and secondtrenches 101 and 103.

In an exemplary embodiment, the isolation pattern 130 is formed byforming an isolation layer on the substrate 100 and the first masks 110to sufficiently fill the first and second trenches 101 and 103,planarizing the isolation layer until a top surface of the active fin105 is exposed, and removing an upper portion of the isolation layer toexpose upper portions of the first and second trenches 101 and 103. Whenthe upper portion of the isolation layer is removed, the first masks 110are also removed.

When the upper portion of the isolation layer is removed, a portion ofthe active fin 105 adjacent thereto may be also removed, and thus awidth of a portion of an upper active pattern 105 a of which a sidewallis not covered by the isolation pattern 130 may be smaller than a widthof a portion of a lower active pattern 105 b of which a sidewall iscovered by the isolation pattern 130. The isolation layer may be formedof an oxide (e.g., silicon oxide).

Alternatively, the isolation pattern 130 may be formed, after removingthe first masks 110, by forming an isolation layer on the substrate 100to sufficiently fill the trenches 101 and 103, planarizing the isolationlayer until the top surface of the active fin 105 is exposed, andremoving an upper portion of the isolation layer to expose the upperportions of the first and second trenches 101 and 103.

Accordingly, as the isolation pattern 130 is formed on the substrate100, a field region having a top surface covered by the isolationpattern 130, and an active region having a top surface not covered bythe isolation pattern 130 may be defined in the substrate 100. That is,the active region may be a region in which the active fin 105 is formed,and the field region may be a region in which no active fin is formed.

Referring to FIGS. 12 to 14, a dummy gate structure 170 is formed on thesubstrate 100.

The dummy gate structure 170 may be formed by sequentially forming adummy gate insulation layer, a dummy gate electrode layer and a dummygate mask layer on the active fin 105 of the substrate 100 and theisolation pattern 130, patterning the dummy gate mask layer by aphotolithography process using a second photoresist pattern (not shown)to form a dummy gate mask 160, and sequentially etching the dummy gateelectrode layer and the dummy gate insulation layer using the dummy gatemask 160 as an etching mask. Thus, the dummy gate structure 170 may beformed to include a dummy gate insulation pattern 140, a dummy gateelectrode 150 and the dummy gate mask 160 sequentially stacked on theactive fin 105 of the substrate 100 and a portion of the isolationpattern 130 adjacent thereto in the second direction.

The dummy gate insulation layer may be formed of an oxide (e.g., siliconoxide), the dummy gate electrode layer may be formed of silicon (e.g.,polysilicon), and the dummy gate mask layer may be formed of a nitride(e.g., silicon nitride). The dummy gate insulation layer may be formedby a chemical vapor deposition (CVD) process, an atomic layer deposition(ALD) process, or the like. In CVD, a wafer (e.g., a substrate) isexposed to one or more volatile precursors, which react and/or decomposeon the substrate surface to produce the desired deposit. In ALD, a filmis grown on a substrate by exposing its surface to gaseous precursors.In an embodiment, the dummy gate insulation layer is formed by a thermaloxidation process on an upper portion of the substrate 100, and in thisembodiment, the dummy gate insulation layer is formed only on the upperactive pattern 105 a. In thermal oxidation, an oxidizing agent is forcedto diffuse into the wafer at a high temperature and react with it. Thedummy gate electrode layer and the dummy gate mask layer may be formedby a CVD process, an ALD process, etc.

In an exemplary embodiment, the dummy gate structure 170 is formed toextend in the second direction on the active fins 105 of the substrate100 and the isolation pattern 130, and a plurality of dummy gatestructures 170 are formed to be spaced apart from each other in thefirst direction.

An ion implantation process may be further performed to form an impurityregion (not shown) at an upper portion of the active fin 105 adjacentthe dummy gate structure 170. The ion implantation process may make useof an ion source (e.g., where ions of the desired element are produced),an accelerator (e.g., where the ions are electrostatically accelerated),and a target chamber, where the ions impinge on a target (i.e., thematerial being implanted).

Referring to FIGS. 15 to 17, a gate spacer 180 and a fin spacer 190 areformed on sidewalls of the dummy gate structure 170 and the upper activepattern 105 a, respectively.

In an exemplary embodiment, the gate spacer 180 and the fin spacer 190are formed by forming a spacer layer on the dummy gate structure 170,the active fin 105, and the isolation pattern 130, and anisotropicallyetching the spacer layer. Thus, the gate spacer 180 and the fin spacer190 are not differentiated from each other at an area at which the gatespacer 180 and the fin spacer 190 contact each other, and thus may bemerged with each other. The spacer layer may be formed of a nitride(e.g., silicon nitride, silicon oxynitride, silicon oxycarbonitride,etc.).

The gate spacer 180 is formed on sidewalls of the dummy gate structure170 opposite to each other in the first direction, and the fin spacer190 is formed on sidewalls of the active fin 105 opposite to each otherin the second direction.

Referring to FIGS. 18 to 20, an upper portion of the exposed active fin105 is removed to form a first recess 200.

In an exemplary embodiment, the upper active pattern 105 a of the activefin 105 is removed to form the first recess 200, and thus a top surfaceof the lower active pattern 105 b is exposed. In this embodiment, anupper portion of the lower active pattern 105 b may be also removed.Alternatively, only the upper active pattern 105 a is partially removedto form the first recess 200, and thus the lower active pattern 105 b isnot exposed.

Referring to FIGS. 21 to 23, a source/drain layer 210 filling the firstrecess 200 is formed on the active fin 105.

In an exemplary embodiment, the source/drain layer 210 is formed by aselective epitaxial growth (SEG) process using the top surface of theactive fin 105 exposed by the first recess 200 as a seed.

In an exemplary embodiment, the source/drain layer 210 is formed byperforming an SEG process using a silicon source gas (e.g., disilane(Si₂H₆) gas) and a carbon source gas (e.g., monomethylsilane (SiH₃CH₃)gas) to form a single crystalline silicon carbide layer. Alternatively,the SEG process may be performed using only the silicon source gas(e.g., disilane (Si₂H₆) gas) to form a single crystalline silicon layer.In an exemplary embodiment, an n-type impurity source gas (e.g.,phosphine (PH₃) gas) is also used to form a single crystalline siliconcarbide layer doped with n-type impurities or a single crystallinesilicon layer doped with n-type impurities. Thus, the source/drain layer210 may serve as a source/drain region of a negative-channel metal oxidesemiconductor (NMOS) transistor.

Alternatively, the source/drain layer 210 may be formed by performing anSEG process using a silicon source gas (e.g., dichlorosilane (SiH₂Cl₂)gas) or a germanium source gas (e.g., germane (GeH₄) gas) to form asingle crystalline silicon-germanium layer. In an exemplary embodiment,a p-type impurity source gas (e.g., diborane (B₂H₆) gas) is also used toform a single crystalline silicon-germanium layer doped with p-typeimpurities. Thus, the source/drain layer 210 may serve as a source/drainregion of a positive-channel metal oxide semiconductor (PMOS)transistor.

The source/drain layer 210 may fill the first recess 200, and may befurther grown to contact a portion of the gate spacer 180. Thesource/drain layer 210 may grow not only in the vertical direction butalso in the horizontal direction, and thus may have a cross-sectiontaken along the second direction of which a shape may be a pentagon or ahexagon. In an exemplary embodiment, the source/drain layers 210 on thefirst active fins 105 spaced apart from each other in the seconddirection at the first distance D1 grow to be merged with each other.Accordingly, one merged source/drain layer 210 is formed on the activefins 105 included in each of the first active fin groups. A plurality ofsource/drain layers 210 may be formed on the plurality of first activefin groups, respectively, spaced apart from each other in the seconddirection, and may be spaced apart from each other in the seconddirection.

Referring to FIGS. 24 to 26, a first insulating interlayer 220 is formedon the active fin 105 and the isolation pattern 130 to cover the dummygate structure 170, the gate spacer 180, the fin spacer 190 and thesource/drain layer 210 to a sufficient height, and may be planarizeduntil a top surface of the dummy gate electrode 150 of the dummy gatestructure 170 is exposed. In the planarization process, the dummy gatemask 160 may be also removed, and an upper portion of the gate spacer180 may be partially removed.

The first insulating interlayer 220 may be formed of an oxide (e.g.,silicon oxide). The planarization process may be performed by a chemicalmechanical polishing/planarization (CMP) process and/or an etch backprocess. CMP uses a combination of chemical and mechanical forces (e.g.,an abrasive and corrosive chemical slurry and a polishing pad) to smootha surface.

Referring to FIGS. 27 and 28, the exposed dummy gate electrode 150 andthe dummy gate insulation pattern 140 under the dummy gate electrode 150are removed to form a first opening 230 exposing an inner sidewall ofthe gate spacer 180 and a top surface of the active fin 105 (i.e., a topsurface of the upper active pattern 105 a).

In an exemplary embodiment, the exposed dummy gate electrode 150 isremoved by a dry etch process first, and then a wet etch process usingammonia hydroxide (NH₄OH) as an etching solution. The dummy gateinsulation pattern 140 may be removed by a dry etch process and/or a wetetch process using hydrogen fluoride (HF) as an etching solution.

Referring to FIGS. 29 to 31, a gate structure 270 is formed to fill thefirst opening 230.

In an exemplary embodiment, after performing a thermal oxidation processon the top surface of the active fin 105 exposed by the first opening230 to form an interface pattern 240, a gate insulation layer is formedon the interface pattern 240, the isolation pattern 130, the gate spacer180, and the first insulating interlayer 220, and a gate electrode layeris formed on the gate insulation layer to sufficiently fill a remainingportion of the first opening 230.

The gate insulation layer may be formed of a metal oxide having a highdielectric constant (e.g., hafnium oxide, tantalum oxide, zirconiumoxide, or the like) by a CVD process or an ALD process. The gateelectrode layer may be formed of a material having a low resistance(e.g., a metal such as aluminum, copper, tantalum, etc., or a metalnitride thereof) by an ALD process, a physical vapor deposition (PVD)process, or the like. In an exemplary embodiment, a heat treatmentprocess, e.g., a rapid thermal annealing (RTA) process, a spike rapidthermal annealing (spike RTA) process, a flash rapid thermal annealing(flash RTA) process or a laser annealing process may be furtherperformed. Alternatively, the gate electrode layer may be formed ofdoped polysilicon.

Instead of forming the interface pattern 240 using the thermal oxidationprocess, the interface pattern 240 may be formed by a CVD process, anALD process, or the like, similarly to the gate insulation layer or thegate electrode layer. In this case, the interface pattern 240 may beformed not only on the top surface of the active fin 105 but also on thetop surface of the isolation pattern 130 and the inner sidewall of thegate spacer 180.

The gate electrode layer and the gate insulation layer may be planarizeduntil a top surface of the first insulating interlayer 220 is exposed toform a gate insulation pattern 250 on the interface pattern 240 and theinner sidewall of the gate spacer 180, and a gate electrode 260 fillingthe remaining portion of the first opening 230 on the gate insulationpattern 250. Accordingly, a bottom surface and a sidewall of the gateelectrode 260 may be covered by the gate insulation pattern 250. In anexemplary embodiment, the planarization process is performed by a CMPprocess and/or an etch back process.

The interface pattern 240, the gate insulation pattern 250 and the gateelectrode 260 sequentially stacked form the gate structure 270, and thegate structure 270 together with the source/drain layer 210 may form aPMOS transistor or an NMOS transistor according to the conductivity typeof the impurities doped into the source/drain layer 210.

Referring to FIGS. 32 to 34, a gate mask 280 is formed on a top surfaceof the gate structure 270.

The gate mask 280 may be formed by forming a gate mask layer on the gatestructure 270, the gate spacer 180 and the first insulating interlayer220, and patterning the gate mask layer. The gate mask layer may beformed of a nitride (e.g., silicon nitride).

In an exemplary embodiment, the gate mask 280 extends in the seconddirection to cover the top surface of the gate structure 270, and aplurality of gate masks 280 are formed in the first direction. While thegate mask 280 is illustrated in FIG. 34 as covering a top surface of thegate spacer 180, the inventive concept is not limited thereto.

Referring to FIGS. 35 to 37, a second insulating interlayer 290 isformed on the first insulating interlayer 220 to cover the gate mask280, and the first and second insulating interlayers 220 and 290 arepartially etched to form a second opening 300 exposing an upper surfaceof the source/drain layer 210.

The etching process for the first and second insulating interlayers 220and 290 may be performed by a photolithography process using a thirdphotoresist pattern (not shown). The second insulating interlayer 290may be formed of an oxide (e.g., silicon oxide).

In an exemplary embodiment, the second opening 300 almost entirelyexposes the upper surface of the source/drain layer 210. That is, thesecond opening 300 exposes the entire upper surface of one of thesource/drain layers 210, which is commonly formed on the first activefins 105 included in each of the first active fin groups and extend inthe second direction, except for end portions of a pair of thesource/drain layers 210 opposite to each other in the second direction.

In an exemplary embodiment, a plurality of second openings 300 areformed in the second direction to expose the plurality of source/drainlayers 210, respectively, spaced apart from each other in the seconddirection. Additionally, a plurality of second openings 300 may beformed in the first direction to expose the plurality of source/drainlayers 210, respectively, between the gate structures 270 disposed inthe first direction. In an exemplary embodiment, the second opening 300is formed to be self-aligned with the gate spacers 180 on the sidewallsof each of the gate structures 270 opposite to each other in the firstdirection. Even if the second opening 300 are not aligned with the gatespacer 180, the gate structure 270 may be protected by the gate mask 280thereon.

Referring to FIGS. 38 and 39, according to an exemplary embodiment,after forming a metal layer 310 on the exposed upper surface of thesource/drain layer 210, a sidewall of the second opening 300, and a topsurface of the second insulating interlayer 290, a first barrier layer320 is formed on the metal layer 310, and a first conductive layer 330is formed on the first barrier layer 320 to fill a remaining portion ofthe second opening 300.

Alternatively, after forming the metal layer 310, the first barrierlayer 320 and the first conductive layer 330 are omitted.

The metal layer 310 may be formed of a metal (e.g., titanium, cobalt,nickel, etc.), the first barrier layer 320 may be formed of a metalnitride (e.g., titanium nitride, tantalum nitride, etc.), and the firstconductive layer 330 may be formed of a metal (e.g., tungsten, aluminum,etc.).

Referring to FIGS. 40 and 41, a heat treatment process is performed onthe substrate 100 so that the metal layer 310 and an upper portion ofthe source/drain layer 210 react with each other to form a metalsilicide pattern 340.

Thus, a portion of the metal layer 310 contacting the source/drain layer210, and the upper portion of the source/drain layer 210 contacting themetal layer 310 may be transformed into the metal silicide pattern 340,and a metal layer 310 may remain on the sidewall of the second opening300 and the top surface of the second insulating interlayer 290.

In an exemplary embodiment, the metal silicide pattern 340 is formed onthe entire upper surface of the source/drain layer 210 except for theend portions thereof in the second direction. The metal silicide pattern340 may include a metal silicide (e.g., titanium silicide, cobaltsilicide, nickel silicide, etc.).

Referring to FIGS. 42 and 43, the first conductive layer 330, the firstbarrier layer 320 and the remaining metal layer 310 may be removed toform the second opening 300 exposing the metal silicide pattern 340again, and an insulation layer 350 may be formed on the exposed metalsilicide pattern 340 and the second insulating interlayer 290 to fillthe second opening 300.

The first conductive layer 330, the first barrier layer 320 and theremaining metal layer 310 may be removed by a dry etch process or a wetetch process. In an exemplary embodiment, the first conductive layer 330and the first barrier layer 320 are completely removed in the etchingprocess. Alternatively, the first conductive layer 330 and the firstbarrier layer 320 are not completely removed in the etching process, butsome portions of the first conductive layer 330 and the first barrierlayer 320 remain to form a conductive pattern structure (not shown)including a first conductive pattern (not shown) and a first barrierpattern (not shown).

The insulation layer 350 may be formed of a low-k dielectric material.The insulation layer 350 may be formed of a material that has goodgap-filling characteristics and can be easily planarized. The insulationlayer 350 may be formed of, e.g., SLAM.

Referring to FIGS. 44 to 46, after forming a fourth photoresist pattern360 on the insulation layer 350, the insulation layer 350 is etchedusing the fourth photoresist pattern 360 as an etching mask to form athird opening 370 partially exposing an upper surface of the metalsilicide pattern 340.

The third opening 370 may also expose portions of a top surface and asidewall of the second insulating interlayer 290, a sidewall of the gatemask 280, and a portion of a sidewall of the gate spacer 180.

In an embodiment, the third opening 370 does not entirely expose theupper surface of the metal silicide pattern 340, but exposes an uppersurface of a portion of the metal silicide pattern 340 on one of thefirst active fins 105 included in each of the first active fin groups.

Referring to FIGS. 47 to 50, after removing the fourth photoresistpattern 360, a sacrificial layer 380 is formed on the exposed uppersurface of the metal silicide pattern 340 and the insulation layer 350to fill the third opening 370. A fifth photoresist pattern 390 is formedon the sacrificial layer 380, and the sacrificial layer 380, theinsulation layer 350, the second insulating interlayer 290, and the gatemask 280 are partially etched using the fifth photoresist pattern 390 asan etching mask to form a fourth opening 400 exposing a portion of a topsurface of the gate structure 270.

The sacrificial layer 380 may be formed of an insulation material, e.g.,silicon-based spin-on-hardmask (Si-SOH) or carbon-based spin-on-hardmask(C-SOH).

In an exemplary embodiment, the fourth opening 400 does not entirelyexpose a top surface of the gate structure 270 adjacent the source/drainlayer 210 on each of the first active fin groups, but exposes a topsurface of a portion of the gate structure 270 adjacent a portion of thesource/drain layer 210 on one of the first active fins 105 included ineach of the first active fin groups. That is, a third opening 370exposes an upper surface of a first portion of the metal silicidepattern 340 on one of the source/drain layers 210, and the fourthopening 400 exposes a top surface of a portion of the gate structure 270adjacent a second portion of the metal silicide pattern 340 on one ofthe source/drain layers 210. The first and second portions of the metalsilicide pattern 340 may be spaced apart from each other in the seconddirection.

Referring to FIGS. 1 to 5 again, after removing the fifth photoresistpattern 390 and the sacrificial layer 380 to form the third opening 370again, a second barrier layer may be formed on the exposed upper surfaceof the metal silicide pattern 340, the exposed top surface of the gatestructure 270, the sidewalls of the third and fourth openings 370 and400, the top surface of the second insulating interlayer 290 and the topsurface of the insulation layer 350, and a second conductive layer maybe formed on the second barrier layer to fill remaining portions of thethird and fourth openings 370 and 400.

The second conductive layer and the second barrier layer may beplanarized until a top surface of the second insulating interlayer 290is exposed to form second and first conductive contact plugs 434 and 432to fill the third and fourth openings 370 and 400, respectively, whichmay contact the metal silicide pattern 340 and the gate structure 270,respectively, and the insulation layer 350 may be transformed into aninsulation pattern 355.

The second barrier layer may be formed of a metal nitride (e.g.,titanium nitride, tantalum nitride, etc.) and the second conductivelayer may be formed of a metal (e.g., tungsten, aluminum, etc.). In anexemplary embodiment, the second barrier layer and the second conductivelayer are formed of materials substantially the same as those of thefirst barrier 320 and the first conductive layer 330, respectively.

The first conductive contact plug 432 may include a second conductivepattern 422, and a second barrier pattern 412 covering a bottom and asidewall of the second conductive pattern 422, and the second conductivecontact plug 434 may include a third conductive pattern 424, and a thirdbarrier pattern 414 covering a bottom and a sidewall of the thirdconductive pattern 424. The second conductive contact plug 434 and theinsulation pattern 355 may be disposed in the second direction andcontact each other to form a second contact plug structure.

In an exemplary embodiment, the first conductive contact plug 432 andthe insulation pattern 355 are adjacent to each other in the firstdirection, and may further contact each other. However, the first andsecond conductive contact plugs 432 and 434 do not contact each other,and are thus spaced apart from each other. That is, the secondconductive contact plug 434 may contact the upper surface of the firstportion of the metal silicide pattern 340 on a first source/drain layeramong the source/drain layers 210, and the first conductive contact plug432 may contact the top surface of the gate structure 270 adjacent thesecond portion of the metal silicide pattern 340 on the firstsource/drain layer among the source/drain layers 210. The first andsecond portions of the metal silicide pattern 340 are spaced apart fromeach other in the second direction, and thus the first and secondconductive contact plugs 432 and 434 do not contact each other, but arespaced apart from each other in the second direction.

By the above processes, the semiconductor device may be manufactured.

In the method of manufacturing the semiconductor device, the secondopening 300 may be formed to entirely expose the upper surface of thesource/drain layer 210 commonly on the first active fins 105 included ineach of the first active fin groups, and the upper portion of thesource/drain layer 210 exposed by the second opening 300 may besilicidated. Thus, the metal silicide pattern 340 may be formed on theentire upper surface of the source/drain layer 210 to realize a lowcontact resistance.

Additionally, after forming the insulation layer 350 on the metalsilicide pattern 340 to fill the second opening 300, the insulationlayer 350 may be partially removed to form the third opening 370partially exposing the upper surface of the metal silicide pattern 340and the fourth opening 400 partially exposing the top surface of thegate structure 270, and the second and first conductive contact plugs434 and 432 may be formed to fill the third and fourth openings 370 and400, respectively. Thus, the first and second conductive contact plugs432 and 434, which cannot be electrically shorted with each other andcontact the gate structure 270 and the metal silicide pattern 340,respectively, are formed to overlap a region in which one of the firstactive fin groups is formed. The first and second conductive contactplugs 432 and 434 are not formed on a space between neighboring ones ofthe first active fin groups spaced apart from each other in the seconddirection, so as to enhance the integration degree of the semiconductordevice.

FIGS. 51 to 55 are plan views and cross-sectional views illustrating asemiconductor device in accordance with exemplary embodiments of theinventive concept. Particularly, FIG. 51 is a plan view illustrating thesemiconductor device, and FIGS. 52 to 55 are cross-sectional viewsillustrating the semiconductor device.

FIG. 52 is a cross-sectional view taken along a line A-A′ of FIG. 51,FIG. 53 is a cross-sectional view taken along a line B-B′ of FIG. 51,FIG. 54 is a cross-sectional view taken along a line C-C′ of FIG. 51,and FIG. 55 is a cross-sectional view taken along a line D-D′ of FIG.51.

The semiconductor device may be substantially the same as that of FIGS.1 to 5 except for the gate mask, the metal silicide pattern, theconductive pattern structure, the first conductive contact plug and thesecond conductive plug structure. Thus, like reference numerals refer tolike elements, and detailed descriptions thereon are omitted herein.

Referring to FIGS. 51 to 55, the semiconductor device includes the gatestructure 270, the source/drain layer 210, the first conductive contactplug 432, the second contact plug structure, and a conductive patternstructure disposed on the substrate 100. The semiconductor device mayfurther include the active fin 105, the gate spacer 180, the fin spacer190, a metal pattern 315, the metal silicide pattern 340, and the firstand second insulating interlayers 220 and 290.

Unlike the semiconductor device illustrated with reference to FIGS. 1 to5, the semiconductor device shown in FIGS. 51 to 55 has no gate mask.However, the inventive concept is not limited thereto, as certainembodiments include the gate mask.

The metal silicide pattern 340 is formed on a bottom and a sidewall of asecond recess (not shown) on an upper portion of the source/drain layer210, and thus has a cross-section taken along the first direction thatis upwardly concave. The metal silicide pattern 340 may be formed on theentire upper surface of the source/drain layer 210 except for endportions of the source/drain layer 210 in each of the first and seconddirections.

The conductive pattern structure may be formed on the metal silicidepattern 340 having the concave shape, and a bottom and a sidewall of theconductive pattern structure may be covered by the metal silicidepattern 340. In an exemplary embodiment, a top surface of the conductivepattern structure is substantially coplanar with a top surface of themetal silicide pattern 340, and is also substantially coplanar with atop surface of the source/drain layer 210 at which no metal silicidepattern is formed.

In an exemplary embodiment, the conductive pattern structure includes afirst barrier pattern 325, and a first conductive pattern 335 of which abottom and a sidewall are covered by the first barrier pattern 325. Thefirst barrier pattern 325 may include a metal nitride (e.g., titaniumnitride, tantalum nitride, etc.) and the first conductive pattern 335may include a metal (e.g., tungsten, aluminum, etc.)

The metal pattern 315 may remain on the end portions of the source/drainlayer 210 in the second direction. In an exemplary embodiment, a topsurface of the metal pattern 315 is substantially coplanar with a topsurface of the conductive pattern structure. The metal pattern 315 mayinclude a metal (e.g., titanium, cobalt, nickel, etc.).

The first conductive contact plug 432 may penetrate through the secondinsulating interlayer 290, and contact a top surface of the gatestructure 270. The first conductive contact plug 432 may contact a topsurface of the gate spacer 180, however, the inventive concept is notlimited thereto.

In an embodiment, the second contact plug structure includes the secondconductive contact plug 434 and the insulation pattern 355, which may bedisposed in the second direction and contact each other. The secondcontact plug structure may penetrate through the first and secondinsulating interlayers 220 and 290, and may contact a top surface of theconductive pattern structure and an upper surface of the metal silicidepattern 340. In an exemplary embodiment, the second contact plugstructure does not contact the outer sidewall of the gate spacer 180.

In an exemplary embodiment, the first conductive contact plug 432 andthe insulation pattern 355 are adjacent to each other in the firstdirection, but do not contact each other. The first and secondconductive contact plugs 432 and 434 do not contact each other, and arethus spaced apart from each other.

Like the semiconductor device illustrated with reference to FIGS. 1 to5, in an embodiment, the second conductive contact plug 434 contacts anupper surface of a first portion of the metal silicide pattern 340 andthe conductive pattern structure on a first source/drain layer 210 amongthe source/drain layers 210, and the first conductive contact plug 432contacts a top surface of the gate structure 270 adjacent a secondportion of the metal silicide pattern 340 and the conductive patternstructure on the first source/drain layer 210 among the source/drainlayers 210. The first and second portions of the metal silicide pattern340 may be spaced apart from each other in the second direction, andthus the first and second conductive contact plugs 432 and 434 do notcontact each other, but are spaced apart from each other in the seconddirection.

Like the semiconductor device illustrated with reference to FIGS. 1 to5, the semiconductor device includes the metal silicide pattern 340,which may be formed on the entire upper surface of the source/drainlayer 210 except for both end portions of the upper surface of thesource/drain layer 210 in the second direction that is commonly formedon the first active fins 105 included in each of the first active fingroups. Thus, the contact resistance between the metal silicide pattern340 and the conductive pattern structure, and the first and secondconductive contact plugs 432 and 434 may be lowered. The first andsecond conductive contact plugs 432 and 434 are formed to overlap aregion in which one of the first active fin groups is formed, and is notformed on a region between neighboring ones of the first active fingroups spaced apart from each other in the second direction.Accordingly, the semiconductor device may have an enhanced integrationdegree.

FIGS. 56 to 62 are plan views and cross-sectional views illustratingstages of a method of manufacturing a semiconductor device in accordancewith exemplary embodiments of the inventive concept. Particularly, FIG.56 is a plan view, and FIGS. 57 to 62 are cross-sectional views.

FIGS. 57, 59 and 61 are cross-sectional views taken along lines B-B′ ofFIG. 56, respectively, and FIGS. 58, 60 and 62 are cross-sectional viewstaken along lines C-C′ of FIG. 56, respectively.

This method may include processes substantially the same as or similarto those illustrated with reference to FIGS. 6 to 50 and 1 to 5, andlike reference numerals refer to like elements, and detaileddescriptions thereon are omitted herein.

First, processes substantially the same as or similar to thoseillustrated with reference to FIGS. 6 to 31 may be performed. Then, theprocess for forming the gate mask 280 illustrated with reference toFIGS. 32 to 34 may or may not be performed. Hereinafter, only the casein which the process for forming the gate mask 280 is not performed willbe illustrated.

Referring to FIGS. 56 to 58, a process substantially the same as orsimilar to that illustrated with reference to FIGS. 35 to 37 isperformed so that a second insulating interlayer 290 is formed on thefirst insulating interlayer 220 to cover the gate structure 270, and thefirst and second insulating interlayers 220 and 290 are partially etchedto form a second opening 300 exposing an upper surface of thesource/drain layer 210.

In an exemplary embodiment, the second opening 300 exposes the entireupper surface of the source/drain layer 210 except for end portions ofthe source/drain layer 210 in each of the first and second directions.In the process illustrated with reference to FIGS. 35 to 37, the secondopening 300 is formed to be self-aligned with the outer wall of the gatespacer 180 so as to expose the upper surface of the source/drain layer210 except for the end portions thereof in the second direction. Whilein the process illustrated with reference to FIGS. 56 to 58, the secondopening 300 is formed not to be self-aligned with the outer wall of thegate spacer 180. Thus, even though the second opening 300 may bemis-aligned, the gate structure 270 is not damaged by the process offorming the second opening 300 even without a gate mask. However, thesecond opening 300 may still entirely expose the upper surface of thesource/drain layer 210 except for the end portions of the source/drainlayer 210 in the second direction.

In an exemplary embodiment, a plurality of second openings 300 areformed in the second direction to expose the plurality of source/drainlayers 210, respectively, spaced apart from each other in the seconddirection. Additionally, a plurality of second openings 300 are formedin the first direction to expose the plurality of source/drain layers210, respectively, between the gate structures 270 disposed in the firstdirection.

In an exemplary embodiment, an upper portion of the source/drain layer210 exposed during the formation of the second opening 300 is partiallyremoved, and thus a bottom of the second opening 300 is lower than a topsurface of a portion of the source/drain layer 210 on which no secondopening is formed. Thus, a metal silicide pattern 340 (refer to FIGS. 59and 60) subsequently formed may contact a second conductive contact plug434 (refer to FIGS. 51 to 55) well so as to prevent the increase of thecontact resistance.

Referring to FIGS. 59 and 60, a process substantially the same as orsimilar to that illustrated with reference to FIGS. 38 to 41 isperformed.

Thus, after sequentially forming a metal layer 310 and a first barrierlayer 320 on the bottom and a sidewall of the second opening 300 and thesecond insulating interlayer 290, a first conductive layer 330 is formedto fill a remaining portion of the second opening 300. A heat treatmentprocess is performed on the substrate 100 so that the metal layer 310and an upper portion of the source/drain layer 210 react with each otherto form a metal silicide pattern 340.

In an exemplary embodiment, the metal silicide pattern 340 is formed onthe source/drain layer 210 exposed by the second opening 300. Inparticular, the metal silicide pattern 340 is formed on the entire uppersurface of the source/drain layer 210 except for the end portionsthereof in each of the first and second directions. The metal silicidepattern 340 may have a cross-section taken along the first directionthat is upwardly concave.

Referring to FIGS. 60 and 61, a process substantially the same as orsimilar to that illustrated with reference to FIGS. 42 to 43 isperformed so that the first conductive layer 330, the first barrierlayer 320 and the metal layer 310 are removed to form a second recess(not shown), and an insulation layer 350 is formed on the secondinsulating interlayer 290 to fill the second recess.

Unlike the process for forming the second opening 300, during theprocess for forming the second recess, the first conductive layer 330,the first barrier layer 320 and the metal layer 310 are not completelyremoved, but some portions thereof remain, and thus the metal silicidepattern 340 is not exposed. In an exemplary embodiment, the secondrecess is formed by a dry etch process, and the first conductive layer330, the first barrier layer 320 and the metal layer 310 are removeduntil a top surface of the source/drain layer 210 not exposed by thesecond opening 300 is exposed.

Thus, a first barrier pattern 325 and a first conductive pattern 335remain on the metal silicide pattern 340 that are formed on a bottom anda sidewall of the second opening 300 to have an upwardly concave shape,and may form a conductive pattern structure. A bottom and a sidewall ofthe first conductive pattern 335 may be covered by the first barrierpattern 325. A metal pattern 315 may remain on end portions of thesource/drain layer 210 in the second direction.

In an exemplary embodiment, top surfaces of the conductive patternstructure and the metal pattern 315 are substantially coplanar with atop surface of the concave metal silicide pattern 340, and aresubstantially coplanar with the top surface of the source/drain layer210 on which no metal silicide pattern 340 is formed.

Referring to FIGS. 51 to 55 again, processes substantially the same asor similar to those illustrated with reference to FIGS. 44 to 50 andFIGS. 1 to 5 are performed to complete the semiconductor device.

Thus, a first conductive contact plug 432 may be formed to contact a topsurface of a portion of the gate structure 270, and a second contactplug structure may be formed to contact a top surface of the conductivepattern structure and an upper surface of a portion of the metalsilicide pattern 340. The second contact plug structure may include asecond conductive contact plug 434 and an insulation pattern 355 that isdisposed in the second direction to contact each other.

In an exemplary embodiment, the first conductive contact plug 432 andthe insulation pattern 355 are adjacent to each other in the firstdirection. However, unlike those illustrated with reference to FIGS. 1to 5, the first conductive contact plug 432 does not contact theinsulation pattern 355, but is spaced apart therefrom. Additionally, thesecond contact plug structure does not contact the outer wall of thegate spacer 180.

Like those illustrated with reference to FIGS. 1 to 5, the secondconductive contact plug 434 contacts an upper surface of a first portionof the metal silicide pattern 340 and the conductive pattern structureon a first source/drain layer 210 among the source/drain layers 210, andthe first conductive contact plug 432 contacts a top surface of the gatestructure 270 adjacent a second portion of the metal silicide pattern340 and the conductive pattern structure on the first source/drain layeramong the source/drain layers 210. The first and second portions of themetal silicide pattern 340 may be spaced apart from each other in thesecond direction, and thus the first and second conductive contact plugs432 and 434 do not contact each other, but are spaced apart from eachother in the second direction.

FIGS. 63 to 67 are plan views and cross-sectional views illustrating asemiconductor device in accordance with example embodiments.Particularly, FIG. 63 is a plan view illustrating the semiconductordevice, and FIGS. 64 to 67 are cross-sectional views illustrating thesemiconductor device.

FIG. 64 is a cross-sectional view taken along a line A-A′ of FIG. 63,FIG. 65 is a cross-sectional view taken along a line B-B′ of FIG. 63,FIG. 66 is a cross-sectional view taken along a line C-C′ of FIG. 63,and FIG. 67 is a cross-sectional view taken along a line D-D′ of FIG.63.

The semiconductor device may be substantially the same as that of FIGS.1 to 5 except for the active region. Thus, like reference numerals referto like elements, and detailed descriptions thereon are omitted herein.

Referring to FIGS. 63 to 67, the semiconductor device includes the gatestructure 270, the source/drain layer 210, the first conductive contactplug 432, and the second contact plug structure disposed on thesubstrate 100. The semiconductor device may further include the gatespacer 180, the gate mask 280, the metal silicide pattern 340, and thefirst and second insulating interlayers 220 and 290.

The isolation pattern 130 may be formed on the substrate 100, and thus afield region of which a top surface is covered by the isolation pattern130, and an active region 107 of which a top surface is not covered bythe isolation pattern 130 may be defined in the substrate 100. In anexemplary embodiment, the active region 107 extends in the firstdirection, and a plurality of active regions 107 are formed in thesecond direction.

The metal silicide pattern 340 may be formed on an entire upper surfaceof the source/drain layer 210 on one of the active regions 107 exceptfor end portions of the source/drain layer 210 in the second direction,and thus the contact resistance between the metal silicide pattern 340and the second conductive contact plug 434 may be lowered.

The second conductive contact plug 434 may contact an upper surface of afirst portion of the metal silicide pattern 340, and the firstconductive contact plug 432 may contact a top surface of the gatestructure 270 adjacent a second portion of the metal silicide pattern340. Thus, the first and second conductive contact plugs 432 and 434,which do not contact each other but are spaced apart from each other,are formed on one of the active regions 107, and are not formed on aspace between neighboring ones of the active regions 107 spaced apartfrom each other in the second direction. Accordingly, the semiconductordevice may have an enhanced integration degree.

FIGS. 68 to 77 are plan views and cross-sectional views illustratingstages of a method of manufacturing a semiconductor device in accordancewith exemplary embodiments of the inventive concept. Particularly, FIGS.68, 70, 72 and 75 are plan views, and FIGS. 69, 71, 73-74 and 76-77 arecross-sectional views.

FIG. 69 is a cross-sectional view taken along a line A-A′ of acorresponding plan view, FIGS. 71, 73 and 76 are cross-sectional viewstaken along lines B-B′ of corresponding plan views, respectively, andFIGS. 74 and 77 are cross-sectional views taken along lines C-C′ ofcorresponding plan views, respectively.

This method may include processes substantially the same as or similarto those illustrated with reference to FIGS. 6 to 50 and 1 to 5, andlike reference numerals refer to like elements, and detaileddescriptions thereon are omitted herein.

Referring to FIGS. 68 and 69, an upper portion of a substrate 100 ispartially removed using a first photoresist pattern (not shown) as anetching mask to form a trench (not shown), and an isolation pattern 130is formed on the substrate 100 to fill the trench and have a top surfacesubstantially coplanar with a top surface of the substrate 100.

Thus, a field region of which a top surface is covered by the isolationpattern 130 and an active region 107 of which a top surface is notcovered by the isolation pattern 130 may be defined in the substrate100. In an exemplary embodiment, the active region 107 extends in thefirst direction, and a plurality of active regions 107 are formed in thesecond direction.

Referring to FIGS. 70 and 71, processes substantially the same as orsimilar to those illustrated with reference to FIGS. 12 to 17 may beperformed so that a dummy gate structure 170 is formed on the activeregion 107 of the substrate 100 and the isolation pattern 130 to extendin the second direction, and a gate spacer 180 is formed on sidewalls ofthe dummy gate structure 170 in the first direction.

Referring to FIGS. 72 to 74, processes substantially the same as orsimilar to those illustrated with reference to FIGS. 18 to 23 may beperformed so that an upper portion of the active region 107 not coveredby the dummy gate structure 170 and the gate spacer 180 is removed toform a first recess (not shown), and a source/drain layer 210 is formedon the active region 107 to fill the first recess.

Referring to FIGS. 75 to 77, processes substantially the same as orsimilar to those illustrated with reference to FIGS. 24 to 37 may beperformed so that a first insulating interlayer 220, a gate structure270 and a gate mask 280 are formed, a second insulating interlayer 290is formed to cover the gate mask 280, and the first and secondinsulating interlayers 220 and 290 are partially etched to form a secondopening 300 exposing an upper surface of the source/drain layer 210.

In exemplary embodiment, the second opening 300 entirely expose theupper surface of the source/drain layer 210. That is, the second opening300 entirely exposes the upper surface of the source/drain layer 210 onthe active region 107 except for end portions of the source/drain layer210 in the second direction.

In an exemplary embodiment, a plurality of second openings 300 areformed to expose the plurality of source/drain layers 210, respectively,spaced apart from each other in the second direction. Additionally, thesecond openings 300 may be formed to expose the source/drain layers 210between neighboring ones of the gate structures 270 disposed in thefirst direction. In an exemplary embodiment, the second opening 300 isformed to be self-aligned with sidewalls of each of the gate structures270 in the first direction.

Referring to FIGS. 63 to 67, processes substantially the same as orsimilar to those illustrated with reference to FIGS. 38 to 50 and FIGS.1 to 5 may be performed.

Thus, a metal silicide pattern 340 may be formed on the entire uppersurface of the source/drain layer 210 except for the end portions of thesource/drain layer 210 in the second direction. Additionally, a secondconductive contact plug 434 may be formed to contact an upper surface ofa first portion of the metal silicide pattern 340, an insulation pattern355 may be formed to contact an upper surface of other portions of themetal silicide pattern 340, and a first conductive contact plug 432 maybe formed to contact a top surface of a portion of the gate structure270 adjacent a second portion of the metal silicide pattern 340. Thefirst and second portions of the metal silicide pattern 340 may bespaced apart from each other in the second direction, and thus the firstand second conductive contact plugs 432 and 434 do not contact eachother, and are spaced apart from each other in the second direction.]

By the above processes, the semiconductor device may be manufactured.

In the above method of manufacturing the semiconductor device, thesecond opening 300 is formed to entirely expose the upper surface of thesource/drain layer 210 on one of the active regions 107, and an upperportion of the source/drain layer 210 exposed by the second opening 300may be silicidated. Thus, the metal silicide pattern 340 may be formedon the entire upper surface of the source/drain layer 210 to realize alow resistance.

Additionally, in an embodiment, after forming an insulation layer on themetal silicide pattern 340 to fill the second opening 300, theinsulation layer is partially removed to form a third opening (notshown) exposing an upper surface of a portion of the metal silicidepattern 340 and a fourth opening (not shown) exposing a top surface of aportion of the gate structure 270, and second and first conductivecontact plugs 434 and 432 are formed to fill the third and fourthopenings, respectively. Thus, the first and second conductive contactplugs 432 and 434, which cannot be electrically shorted with each other,and contact the gate structure 270 and the metal silicide pattern 340,respectively, may be formed to overlap one of the active regions 107.Accordingly, the first and second conductive contact plugs 432 and 434are not formed on a space between neighboring ones of the plurality ofactive regions 107 in the second direction, and the semiconductor devicemay have an enhanced integration degree.

FIGS. 78 to 82 are a plan view and cross-sectional views illustrating asemiconductor device in accordance with exemplary embodiments of theinventive concept. Particularly, FIG. 78 is a plan view illustrating thesemiconductor device, and FIGS. 79 to 82 are cross-sectional viewsillustrating the semiconductor device.

FIG. 79 is a cross-sectional view taken along a line A-A′ of FIG. 78,FIG. 80 is a cross-sectional view taken along a line B-B′ of FIG. 78,FIG. 81 is a cross-sectional view taken along a line C-C′ of FIG. 78,and FIG. 82 is a cross-sectional view taken along a line D-D′ of FIG.78.

The semiconductor device may be substantially the same as that of FIGS.63 to 67 except for the gate mask, the metal silicide pattern, theconductive pattern structure, the first conductive contact plug and thesecond contact plug structure. Additionally, the gate mask, the metalsilicide pattern, the conductive pattern structure, the first conductivecontact plug and the second contact plug structure of the semiconductordevice may be substantially the same as that of FIGS. 51 to 55. Thus,like reference numerals refer to like elements, and detaileddescriptions thereon are omitted herein.

Referring to FIGS. 78 to 82, the semiconductor device may include thegate structure 270, the source/drain layer 210, the first conductivecontact plug 432, the second contact plug structure and the conductivepattern structure disposed on the substrate 100. The semiconductordevice may further include the gate spacer 180, the metal pattern 315,the metal silicide pattern 340, and the first and second insulatinginterlayers 220 and 290.

The isolation pattern 130 may be formed on the substrate 100, and thus afield region of which a top surface is covered by the isolation pattern130, and an active region 107 of which a top surface is not covered bythe isolation pattern 130 may be defined in the substrate 100. In anexemplary embodiment, the active region 107 extends in the firstdirection, and a plurality of active regions 107 are formed in thesecond direction.

The metal silicide pattern 340 may be formed on an entire upper surfaceof the source/drain layer 210 on one of the active regions 107 exceptfor end portions of the source/drain layer 210 in each of the first andsecond directions, and the conductive pattern structure may be formed onthe metal silicide pattern 340. Thus, the contact resistance between thesecond conductive contact plug 434 and the metal silicide pattern 340and the conductive pattern structure may be lowered.

The second conductive contact plug 434 may contact an upper surface of afirst portion of the metal silicide pattern 340 and the conductivepattern structure, and the first conductive contact plug 432 may contacta top surface of the gate structure 270 adjacent a second portion of themetal silicide pattern 340 and the conductive pattern structure. Thefirst and second portions may be spaced apart from each other in thesecond direction, and thus the first and second conductive contact plugs432 and 434 do not contact each other but are spaced apart from eachother.

In an embodiment, the first and second conductive contact plugs 432 and434 are formed to overlap one of the active regions 107, and are notformed on a space between neighboring ones of the active regions 107spaced apart from each other in the second direction. Accordingly, thesemiconductor device may have an enhanced integration degree.

The above semiconductor device and the method of manufacturing the samemay be applied to various types of memory devices including contactplugs. For example, the semiconductor device and the method ofmanufacturing the same may be applied to logic devices such as centralprocessing units (CPUs), main processing units (MPUs), applicationprocessors (APs), or the like. Additionally, the semiconductor deviceand the method of manufacturing the same may be applied to volatilememory devices such as dynamic random access memory (DRAM) devices orstatic random access memory (SRAM) devices, or non-volatile memorydevices such as flash memory devices, phase-change memory (PRAM)devices, magnetoresistive random access (MRAM) devices, resistancerandom access memory (RRAM) devices, or the like.

The foregoing is illustrative of exemplary embodiments of the inventiveconcept and is not to be construed as limiting thereof. Although a fewexemplary embodiments have been described, those skilled in the art willreadily appreciate that many modifications are possible in the exemplaryembodiments without materially departing from the present inventiveconcept. Accordingly, all such modifications are intended to be includedwithin the scope of the present inventive concept.

1. A semiconductor device, comprising: a gate structure extending in asecond direction on a substrate; a source/drain layer disposed on aportion of the substrate adjacent the gate structure in a firstdirection crossing the second direction; a first conductive contact plugdisposed on the gate structure; and a second contact plug structuredisposed on the source/drain layer, the second contact plug structureincluding a second conductive contact plug and an insulation pattern,wherein the second conductive contact plug and the insulation patternare disposed in the second direction and contact each other, wherein thefirst conductive contact plug and the insulation pattern are adjacent toeach other in the first direction, and wherein the first and secondconductive contact plugs are spaced apart from each other.
 2. Thesemiconductor device of claim 1, further comprising a metal silicidepattern disposed on the source/drain layer, wherein the second contactplug contacts an upper surface of the metal silicide pattern.
 3. Thesemiconductor device of claim 2, wherein the metal silicide pattern isdisposed on an entire upper surface of the source/drain layer, andwherein the second conductive contact plug contacts an upper surface ofa portion of the metal silicide pattern.
 4. The semiconductor device ofclaim 1, wherein the first conductive contact plug and the insulationpattern contact each other.
 5. The semiconductor device of claim 1,further comprising a gate spacer disposed on sidewalls of the gatestructure in the first direction, wherein the second contact plugstructure contacts an outer sidewall of the gate spacer.
 6. Thesemiconductor device of claim 1, further comprising a metal silicidepattern and a conductive pattern structure sequentially stacked betweenthe source/drain layer and the second contact plug structure, wherein anupper surface of a portion of the metal silicide pattern and a topsurface of the conductive pattern structure contact the second contactplug structure.
 7. The semiconductor device of claim 6, wherein themetal silicide pattern is disposed on an inner wall of a recess, therecess being disposed on the source/drain layer, and wherein theconductive pattern structure fills a remaining portion of the recess onthe metal silicide pattern.
 8. The semiconductor device of claim 7,wherein the conductive pattern structure includes a first conductivepattern and a first barrier pattern covering a bottom and a sidewall ofthe first conductive pattern.
 9. The semiconductor device of claim 8,wherein the first conductive pattern includes tungsten, and the firstbarrier pattern includes titanium nitride.
 10. The semiconductor deviceof claim 6, further comprising a gate spacer disposed on sidewalls ofthe gate structure in the first direction, wherein the second contactstructure does not contact an outer sidewall of the gate spacer.
 11. Thesemiconductor device of claim 1, wherein the insulation pattern includesa low-k dielectric material.
 12. The semiconductor device of claim 8,wherein the first conductive contact plug includes a second conductivepattern and a second barrier pattern covering a bottom and a sidewall ofthe second conductive pattern, and wherein the second conductive contactplug includes a third conductive pattern and a third barrier patterncovering a bottom and a sidewall of the third conductive pattern. 13.The semiconductor device of claim 12, wherein the second and thirdconductive patterns include tungsten, and the second and third barrierpatterns include titanium nitride.
 14. The semiconductor device of claim1, further comprising: an isolation pattern disposed on the substrate;and an active fin protruding from the substrate, a lower sidewall of theactive fin being covered by the isolation pattern.
 15. The semiconductordevice of claim 14, wherein a plurality of active fins are spaced apartfrom each other in the second direction, and wherein the source/drainlayer commonly contacts first active fins among the plurality of activefins, the first active fins being adjacent to each other in the seconddirection.
 16. The semiconductor device of claim 15, wherein a pluralityof source/drain layers are spaced apart from each other on the substratein the second direction, and wherein the second contact plug structurevertically overlaps each of the source/drain layers, the firstconductive contact plug is disposed on the gate structure adjacent thesecond contact plug structure in the first direction, and the firstconductive contact plug and the second contact plug structure are notdisposed between neighboring ones of the source/drain layer spaced apartfrom each other in the second direction. 17-23. (canceled)
 24. Asemiconductor device, comprising: a plurality of first active fin groupsspaced apart from each other in a second direction at a second distance,each of the first active fin groups including a plurality of firstactive fins spaced apart from each other in the second direction at afirst distance smaller than the second distance, each of the firstactive fins protruding from a substrate and extending in a firstdirection substantially perpendicular to the second direction; a gatestructure extending in the second direction and disposed on a portion ofthe substrate having the first active fin groups; a plurality ofsource/drain layers spaced apart from each other in the seconddirection, each of the source/drain layers being disposed on a portionof each of the first active fin groups adjacent the gate structure; ametal silicide pattern disposed on each of the source/drain layers; asecond conductive contact plug contacting an upper surface of a firstportion of the metal silicide pattern; and a first conductive contactplug contacting an upper surface of a portion of the gate structureadjacent each of the source/drain layers in the first direction, thefirst conductive contact plug being spaced apart from the secondconductive contact plug.
 25. The semiconductor device of claim 24,further comprising an insulation pattern contacting an upper surface ofa second other portion of the metal silicide pattern, the insulationpattern and the second conductive contact plug being disposed in thesecond direction and contacting each other.
 26. The semiconductor deviceof claim 25, further comprising a conductive pattern structure locatedbetween the metal silicide pattern and a second contact plug structurecomprising the second conductive contact plug and the insulationpattern. 27-58. (canceled)
 59. A semiconductor device, comprising: agate electrode disposed on a substrate and extending in a seconddirection; a source electrode disposed on the substrate adjacent a firstside of the gate electrode in a first direction crossing the seconddirection; a drain electrode disposed on the substrate adjacent a secondside of the gate electrode in the first direction; a first conductivecontact plug disposed on the gate electrode; a second conductive contactplug disposed on the source electrode in the second direction; a thirdconductive contact plug disposed on the drain electrode in the seconddirection; a first insulation pattern disposed on the source electrodein the second direction and contacting the second conductive contactplug; and a second insulation pattern disposed on the drain electrode inthe second direction and contacting the third conductive contact plug.60-61. (canceled)